ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,766, issued on April 14, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package structure" was invented by Hsiao-Yun... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,767, issued on April 14, was assigned to Shanghai Biren Technology Co. Ltd (Shanghai). "Chipset and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,767, issued on April 14, was assigned to Shanghai Biren Technology Co. Ltd (Shanghai). "Chipset and method of manufacturing the same" was ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,768, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of fab... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,768, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package and method of fab... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,769, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Backlight unit and display device including the same" ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,769, issued on April 14, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Backlight unit and display device including the same" ... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,770, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Heu... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,770, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Heu... Read More
ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,771, issued on April 14, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Direct bonding methods and str... Read More